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Wire Pull
Wire Pull is the one of the basic tests. It confirms wire’s weakness caused by stitch’s cementing power and odd loop. We test in accordance with JEDEC.

Ball Shear
Ball Shear is the one of the basic tests. It confirms a cementing power on bond ball’s alloyed layer. We test in accordance with JEDEC.

Die Shear
Die Shear is the one of the basic tests. It confirms if DIE adheres on the L/F by pushing DIE.
We test in accordance with

Cold Bump Pull
The cavity formed on solder resist layer is at the bottom on the solder balls bond. A custom-made jaw is needed to proceed a cold bump pull test. We follow JEDEC standard.

First Bond Ball Pull
It is performed as alternative test of ball shear which is applied for copper wire ball bonding.
We use cold bump pull jaw technology to apply vertically in the direction of  ball bond and stud bump.

The Fatigue test is proceeded by giving low impact or high impact to the ball. Through multiple impact tests, we can check strength and pressure for ball.

Wedge Shear
 It is needed to test bonding aluminum. The measurement of touchdown and shear height should be accurate to protect IMC from damage. Also, shear tool should be matched with wedge because high force is applied during test.

Cavity Shear
This test is too useful when we test a ball bond surrounded by a thick layer of passivation and it is difficult for landing, touchdown and setting up a tool to control height.

Vector pull
This vector pull test is optimum when we test short loop wire. We can test it at any angle.

Ribbon Pull/Shear
We perform this test (up to 5kg) as an alternative ribbon pull test. It is significant for angle and XY stage above work holder, especially   linearity guide to proceed the test correctly.

High Speed Impact
It is available to test at 5m/sec. We proceed this test to analyze failure mode and guarantee a quality.

Zone Shear
We proceed zone shear test by destructing hundreds of balls at once. We can visually analyze destructed share zone and it makes available effective analysis in terms of saving time.

Tweezer Pull
 Tweezer pull testing is similar with standard pull test. It is proceeded to verify the adhesion or strength of a bond and useful for wires, ribbons, pins, balls or components test.

Stud Pull
 It is for High strength adhesive, especially that stud pull test is used for bonded dies or pins pressed in FR4 boards. The test is proceeded under 500degree.

Die Crush
It is required when we test strength of the Die adhesived on the circuit board. It is available for Die Crush test Max50Kg.

Bending test is to figure out if the substrate has enough elastic force. Regarding composite materials, the test is proceeded in consider of pattern and direction.