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Bump Pull, Bump Shear test machine for 200 & 300mm
   wafers including high precision, higher speed
Unique system combined with Robot handling system,
   Bond Tester system, Micro Vickers hardness test system
One touch automatic XY positioning by clicking on a
   position of wafer image on GUI program
Work zone auto-detection for lowering the speed of
   Z stage
Micro vickers hardness test system, ± 1% accuracy for
   10, 15, 25 gram
Test accuracy ± 0.15%(standard of JEDEC, MILS, EIA )