Home    Contact us    Sitemap    Groupware
Wire Pull, Push, various Ball/Die Shear Destructive &
   Non-destructive test (up to 200Kg)
Easier interconnection to connect automatic robot
   handling system
Wider XY Stage 750 * 600 mm for 200~300mm wafer
Wafer chuck up/down system with minimized manual
   wafer handling
Controllable XYZ stage speed by Joystick touch
One touch auto-XY positioning by clicking on a position
    of wafer image on GUI program
User-friendly L/R joystick button, L-activation XY motor
    at its maximum speed, R-test
Loadless bottom touch on wafer when testing a ball
GUI program ? the state-of-the-art user friendly
    Window 7 based O/S program
Professional SPC analysis program inside OS program
Networking to remote PC or hose PC
International regulation (JEDEC, MILS, EIA) based
   system, system accuracy, ± 0.25%